Working desk with finishing technologies equipment to enable post-fabrication packaging
Zepler Cleanrooms

Backend, dice and bond

Equipment to enable finishing technologies for post-fabrication packaging.

About our backend, dice and bond capability

Part of the nanofabrication cleanrooms

The nanofabrication cleanrooms have a range of finishing technologies to enable post-fabrication packaging. We offer automated dicing up to 200 millimetres (mm), and semi-automated scribing of substrates up to 400mm. We create device connections via manual wirebonding, manual flip chip bonding, or automated flip chip die bonding.  

We can also prototype novel processes. These include:

  • wafer-wafer polymer/glue bonding
  • microfluidic system encapsulation
  • flip chip bonding for heterogenous integration. For example, III-V components onto silicon or dielectric waveguide substrates
A person working at Mitsuboshi scribe and dice tool
Mitsuboshi scribe and dice tool

 

Processes and equipment

Scribing and dicing 

 

  • dicing saw for silicon (Si), germanium (Ge), III-V substrate sizes from small samples up to 200mm wafers, position accuracy 0.5 micrometres (μm)  
  • Mitsuboshi Diamond Industrial scriber for Si, silicon dioxide (SiO2), and sapphire substrates up to 400mm per side

 

Manual bonding 

 

  • manual flip chip bonding, 0.5μm accuracy, 1-400 newtons, up to 550°C  
  • manual wirebonder for gold and aluminium (Al, Au) 

 

Automated bonding

 

  • ASMPT Amicra nano die bonder for automated pick and place flip chip heterogeneous integration applications.  Positioning capability 0.3μm to 1 standard deviation

 

A person in a uniform working at Disco DAD341 wafer saw
Disco DAD341 wafer saw

 

Contact us

For more information or to book the facilities, get in touch: zepler.cleanrooms@soton.ac.uk