Module overview
This module provides an overview of modern microfabrication technologies for the making of micro structures applicable to device engineering.
The various fabrication techniques that are relevant for microdevices in the field of electronics, optoelectronics and micro-electro-mechanical systems (MEMS) will be addressed in the lectures, with an emphasis on their physical, mechanical and chemical principles. The integration of these techniques will be explained with examples of complete process flow for the fabrication of different microdevices. Element of design method to produce microdevices will be introduced.
Linked modules
Pre-requisite: ELEC3207 OR ELEC6259
Aims and Objectives
Learning Outcomes
Subject Specific Intellectual and Research Skills
Having successfully completed this module you will be able to:
- Appreciate how fabrication process limitations influence device design
- Design a process flow for micro devices such as electronics, optoelectronics, sensors, and MEMS
Subject Specific Practical Skills
Having successfully completed this module you will be able to:
- Perform device fabrication process design and characterisation procedures
Transferable and Generic Skills
Having successfully completed this module you will be able to:
- Write concise technical/laboratory reports in the format of a journal paper
Knowledge and Understanding
Having successfully completed this module, you will be able to demonstrate knowledge and understanding of:
- The microfabrication technology for the microsystem devices that are used in modern electronic, optoelectronic and lab-on-a-chip applications
- Fabrication process flow of creating micro devices in a cleanroom environment
Syllabus
Microfabrication introduction and overview
- Material for fabrication
- Fabrication equipment
- Growth technology
- Silicon-based process
Fabrication technology
- Pattern transfer technology
- Lithography – photolithography
- Resist technology
- Micromachining – wet etch and dry etch
- Materials processing technology
- Material deposition methods
- Basic ion implantation and diffusion doping process
- Low and high temperature process
- Device packaging methods
Characterisation technology for microfabrication processes
Microfabrication process integrations
Learning and Teaching
Teaching and learning methods
Lectures, Tutorials, Lab and Coursework
Type | Hours |
---|---|
Wider reading or practice | 62 |
Preparation for scheduled sessions | 12 |
Tutorial | 6 |
Follow-up work | 12 |
Revision | 10 |
Lecture | 24 |
Completion of assessment task | 24 |
Total study time | 150 |
Resources & Reading list
General Resources
A laboratory manual will be provided.
Comprehensive lecture notes will be provided.
Internet Resources
Introduction to Microfabrication.
Textbooks
Sze SM (2013). Semiconductor Devices: Physics and Technology. international student version, Wiley.
May GS & Sze SM (2004). Fundamentals of Semiconductor Fabrication. Wiley.
Franssila S (2010). Introduction to Microfabrication. Wiley.
On-line journals.
Sze SM (2002). Semiconductor Devices: Physics and Technology.
Madou MJ (2012). Fundamentals of Microfabrication and Nanotechnology. CRC Press.
Madou MJ (2002). Fundamentals of Microfabrication. CRC Press.
Assessment
Assessment strategy
The coursework will not be marked if the student has not attended the laboratory sessions.
Summative
This is how we’ll formally assess what you have learned in this module.
Method | Percentage contribution |
---|---|
Exam | 70% |
A lab report | 30% |
Referral
This is how we’ll assess you if you don’t meet the criteria to pass this module.
Method | Percentage contribution |
---|---|
Exam | 100% |
Repeat
An internal repeat is where you take all of your modules again, including any you passed. An external repeat is where you only re-take the modules you failed.
Method | Percentage contribution |
---|---|
Exam | 100% |
Repeat Information
Repeat type: Internal & External