Vias must be drawn orthogonal to the grid of the layout. Non-Manhattan vias are not allowed.
| Rule | Description | Lambda | |||||
|---|---|---|---|---|---|---|---|
| 2 Metal Process | 3+ Metal Process | ||||||
| SCMOS | SUBM | DEEP | SCMOS | SUBM | DEEP | ||
| 8.1 | Exact size | 2 x 2 | n/a | n/a | 2 x 2 | 2 x 2 | 3 x 3 |
| 8.2 | Minimum via1 spacing | 3 | n/a | n/a | 3 | 3 | 3 |
| 8.3 | Minimum overlap by metal1 | 1 | n/a | n/a | 1 | 1 | 1 |
| 8.4 | Minimum spacing to contact for technology codes mapped to processes that do not allow stacked vias (SCNA, SCNE, SCN3M, SCN3MLC) | 2 | n/a | n/a | 2 | 2 | n/a |
| 8.5 | Minimum spacing to poly or active edge | 2 | n/a | n/a | 2 | 2 | n/a |
| Rule | Description | Lambda | |||||
| 2 Metal Process | 3+ Metal Process | ||||||
| SCMOS | SUBM | DEEP | SCMOS | SUBM | DEEP | ||
| 9.1 | Minimum width | 3 | n/a | n/a | 3 | 3 | 3 |
| 9.2 | Minimum spacing | 3 | n/a | n/a | 3 | 3 | 4 |
| 9.3 | Minimum overlap of via1 | 1 | n/a | n/a | 1 | 1 | 1 |
| 9.4 | Minimum spacing when either metal line is wider than 10 lambda | 6 | n/a | n/a | 6 | 6 | 8 |
